1. 2. 3. material content data sheet sales product name ikp15n65h5 issued 29. august 2013 ma# MA001030836 package pg-to220-3-1 weight* 2030.00 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.079 0.05 0.05 532 532 leadframe non noble metal iron 7439-89-6 0.816 0.04 402 inorganic material phosphorus 7723-14-0 0.245 0.01 121 non noble metal copper 7440-50-8 815.335 40.16 40.21 401643 402167 wire non noble metal aluminium 7429-90-5 4.224 0.21 0.21 2081 2081 encapsulation organic material carbon black 1333-86-4 5.952 0.29 2932 plastics epoxy resin - 113.084 5.57 55706 inorganic material silicondioxide 60676-86-0 476.141 23.46 29.32 234552 293190 leadfinish non noble metal tin 7440-31-5 21.462 1.06 1.06 10573 10573 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder non noble metal antimony 7440-36-0 0.118 0.01 58 noble metal silver 7440-22-4 0.295 0.01 146 non noble metal tin 7440-31-5 0.768 0.04 0.06 378 582 heatspreader non noble metal iron 7439-89-6 0.590 0.03 291 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 29.04 29.08 290377 290755 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
